Effective audio signal processing, low power consumption and noise-cancellation characteristics allow the device to deliver high performance
Concerning microphones, designers often have to accept tradeoffs for high signal-to-noise ratio (SNR), small package, high acoustic overload point and low power consumption to achieve high-performance. This was because the MEMS option had not been available, making designers resort to electret condenser microphones (ECM).
Now with the soon to be launched IM73A135 XENSIV MEMS microphone reduces this need to compromise.
A 73 dB SNR and a high acoustic overload point (135 dB SPL) make for a very high dynamic range microphone with a small footprint of 4 x 3 x 1.2 mm3. The new MEMS microphone also features tight frequency curve matching for an effective audio signal processing and low power consumption of 170 μA, allowing designers to reach high audio performance.
The new MEMS microphone offers noise-cancellation and low self-noise characteristics suited to for high-quality audio capturing required in conference systems, cameras or audio recorders.
The XENSIV MEMS microphone IM73A135 will be available from Infineon Technologies for distribution in March 2021.
Along with the MEMS microphone, the company will also provide new low power digital ASIC technology that can be used in various next-generation digital microphones.