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In electronics manufacturing, Integrated circuit (IC) packaging is the final stage of semiconductor device fabrication. In this process, a tiny block of semiconducting material is encapsulated in a supporting case that prevents physical damage and corrosion.
Upon Completion of the slideshow, you will be able to understand the following points:
- Package Overview
- Through-Hole package
- Surface mount package
- Chip-Scale Package (CSP)
- Wire Bonded BGA
- FC-BGA
- Wafer Level Chip-Scale Package (WL-CSP)
- Advantages of WL-CSP IC
