The ToF 3D LiDAR device with up to 2.3k resolution is changing technology interaction and improving smartphones, cameras, and autonomous driving systems.
STMicroelectronics, a semiconductor company serving electronics applications, have announced a direct Time-of-Flight (dToF) 3D LiDAR module with 2.3k resolution and revealed an early design win for a 500k-pixel indirect Time-of-Flight (iToF) sensor. The technology is expected to find applications across various industries, such as smartphones, tablets, cameras, virtual reality (VR) headsets, augmented reality (AR) device manufacturing, and the automotive sector.
The VL53L9 is a new direct ToF 3D LiDAR device with a resolution of up to 2.3k zones. It integrates a dual scan flood illumination, unique in the market, allowing LiDAR to detect small objects and edges and capture 2D infrared (IR) images and 3D depth map information. The module comes ready to use with low power consumption and on-chip dToF processing, requiring no extra external components or calibration. The device delivers a performance range from 5cm to 10 meters.
It supports camera-assist performance, supporting photography from macro to telephoto. It enables features such as autofocus, bokeh, and cinematic effects for still and video at 60fps (frames per second). Virtual reality (VR) systems can use accurate depth and 2D images to enhance spatial mapping for immersive gaming and other VR experiences like virtual visits or 3D avatars. The sensor’s ability to detect the edges of small objects at short and ultra-long ranges makes it suitable for applications such as virtual reality or SLAM (simultaneous localization and mapping).
“ToF sensors, which can accurately measure the distance to objects in a scene, are driving exciting new capabilities in smart devices, home appliances, and industrial automation. We have already delivered two billion sensors into the market and continue to extend our unique portfolio, which covers all types from the simplest single-zone devices up to our latest high-resolution 3D indirect and direct ToF sensors,” said Alexandre Balmefrezol, General Manager, Imaging Sub-Group at STMicroelectronics.
For more information, click here.
