Friday, December 5, 2025

World-First MLCC Delivering Industry-Highest Capacitance

The first capacitor with 47µF in 0402 size. Made for phones and AI servers. Saves space, works in heat, and supports growing tech needs.

KYOCERA AVX Unveils World-First*1 Multilayer Ceramic Chip Capacitor (MLCC) Delivering Industry-Highest 47μF Capacitance in 0402-inch Size*2
KYOCERA AVX Unveils World-First*1 Multilayer Ceramic Chip Capacitor (MLCC) Delivering Industry-Highest 47μF Capacitance in 0402-inch Size*2

KYOCERA AVX has developed the world’s first compact, high-capacity multilayer ceramic chip capacitor (MLCC) with a capacitance of 47µF in the 0402-inch size. As AI technology grows rapidly, there is rising demand for smartphones with generative AI features and AI servers. At the same time, electronic devices are becoming more complex, requiring more components in limited space. This has created a strong need for small components with higher performance. In the case of MLCCs, this means more capacitance in a smaller size, along with better reliability in high-temperature environments.

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The 0402-inch MLCC is the most common size used in smartphones and wearables. Using its own material and process technologies, KYOCERA AVX has made thinner dielectric layers and internal electrodes, increasing capacitance per unit by about 2.1 times compared to its previous 22µF version. This helps meet space and performance needs while reducing the number of components. The new MLCC also offers heat resistance up to +105°C, making it reliable in high-temperature uses such as AI servers.

Some of the key features of the MLCC include:

  • First in the world to have 47µF in a very small 0402-inch size (1.0mm × 0.5mm)
  • Holds more charge than any other capacitor of this size
  • About 2.1 times more capacity than the older 22µF version
  • Very small, good for smartphones and wearable devices
  • Made using special materials and processes to fit more power in the same space
  • Helps reduce the number of parts needed on a circuit board
  • Can handle heat up to +105°C, useful for hot environments like AI servers

The company claims to develop electronic components that support the miniaturization and improved performance of devices like smartphones and AI servers.

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For more information, click here.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at EFY with a deep interest in embedded systems, development boards and IoT cloud solutions.

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