HomeElectronics NewsWorld-First MLCC Delivering Industry-Highest Capacitance

World-First MLCC Delivering Industry-Highest Capacitance

The first capacitor with 47µF in 0402 size. Made for phones and AI servers. Saves space, works in heat, and supports growing tech needs.

KYOCERA AVX Unveils World-First*1 Multilayer Ceramic Chip Capacitor (MLCC) Delivering Industry-Highest 47μF Capacitance in 0402-inch Size*2
KYOCERA AVX Unveils World-First*1 Multilayer Ceramic Chip Capacitor (MLCC) Delivering Industry-Highest 47μF Capacitance in 0402-inch Size*2

KYOCERA AVX has developed the world’s first compact, high-capacity multilayer ceramic chip capacitor (MLCC) with a capacitance of 47µF in the 0402-inch size. As AI technology grows rapidly, there is rising demand for smartphones with generative AI features and AI servers. At the same time, electronic devices are becoming more complex, requiring more components in limited space. This has created a strong need for small components with higher performance. In the case of MLCCs, this means more capacitance in a smaller size, along with better reliability in high-temperature environments.

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The 0402-inch MLCC is the most common size used in smartphones and wearables. Using its own material and process technologies, KYOCERA AVX has made thinner dielectric layers and internal electrodes, increasing capacitance per unit by about 2.1 times compared to its previous 22µF version. This helps meet space and performance needs while reducing the number of components. The new MLCC also offers heat resistance up to +105°C, making it reliable in high-temperature uses such as AI servers.

Some of the key features of the MLCC include:

  • First in the world to have 47µF in a very small 0402-inch size (1.0mm × 0.5mm)
  • Holds more charge than any other capacitor of this size
  • About 2.1 times more capacity than the older 22µF version
  • Very small, good for smartphones and wearable devices
  • Made using special materials and processes to fit more power in the same space
  • Helps reduce the number of parts needed on a circuit board
  • Can handle heat up to +105°C, useful for hot environments like AI servers

The company claims to develop electronic components that support the miniaturization and improved performance of devices like smartphones and AI servers.

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For more information, click here.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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