New double-sided metallized film capacitors deliver high pulse strength, compact size, and automotive-grade durability for resonant and high-current applications.
TDK has rolled out its new EPCOS B3264xH series of double-sided metallized polypropylene film capacitors, aimed at power electronics engineers tackling high-frequency resonant applications. Designed for demanding environments and resonant topologies such as LLC circuits, these components combine a compact footprint with high durability, enabling use in both automotive and industrial systems.
The key features are:
- Withstands extreme pulse stress up to 6,500 V/µs
- Rated for DC voltages from 630 V to 2000 V
- Capacitance range spans from 2.2 µF to 470 µF
- Double-sided metallized polypropylene and PET dielectric
- High current handling capability
- Operates reliably from –55 °C to +125 °C
Automotive-grade reliability is another standout. AEC-Q200 compliance ensures suitability for harsh environments, while robust self-healing properties and high insulation resistance translate to a service life of 200,000 hours at +85 °C under full rated voltage. Low dissipation factor and compact size also support system-level efficiency and space savings.
The key advantages of these capacitors lie in their compact design combined with high capacitance values, making them ideal for space-constrained applications. They are engineered to handle high pulse and current stress, ensuring robust performance in demanding power environments. Their construction supports reliable operation even in harsh and humid conditions. With AEC-Q200 qualification, they meet stringent automotive-grade standards, and their extended operational life of up to 200,000 hours at +85 °C ensures long-term reliability in both industrial and automotive systems.
Target applications include onboard chargers (OBCs) and DC-DC converters in electric vehicles, as well as switch-mode power supplies (SMPS), uninterruptible power supplies (UPS), and electronic ballasts operating at high frequencies. The capacitors come in three lead spacing options—10 mm, 15 mm, and 22.5 mm—supporting flexible PCB layouts. Key sizes start from 13.0 x 4.0 x 9.0 mm and go up to 26.5 x 14.5 x 29.0 mm. With their rugged performance, compact form factor, and extended operating life, the B3264xH series enables designers to push the limits of power density and thermal endurance in advanced electronic systems. Simulation models for SPICE and ANSYS are available to ease integration into power designs.
