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Location: Hyderabad
Company: Microchip Technology
Job Description
- Looking for a motivated Signal Integrity and Power Integrity Engineer with 3–6 years of experience to support high-speed package and PCB design.
- The candidate will have a strong foundation in SI/PI analysis, modeling, and simulation, along with exposure to package and PCB design.
- The candidate will work closely with system-hardware and packaging teams to ensure robust high-speed performance and reliable power delivery
across products.
Requirements/Qualifications
Education:
- MS/M.Tech in Electronics or equivalent.
Requirements:
- 3–6 years of industry experience in Signal Integrity and Power Integrity for package and/or PCB designs.
- Strong understanding of PDN for Chip packaging/substrate and PCB.
Hands-on experience with SI/PI tools such as Cadence Sigrity, ADS, Ansys SIwave/HFSS, and HyperLynx. - Ability to analyse S-parameters, impedance profiles, TDR results, and PDN frequency responses.
- Familiarity with package design basics.
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