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Press Releases

Press releases on new technological solutions

Press Releases

STMicroelectronics Powers Up Intelligent Edge With Gen-2 STM32 MPUs

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Anritsu Company Expands Inline Sensor Family

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ROHM Develops A New Op Amp That Minimizes Current Consumption

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Anritsu Expands Module Lineup Of Simulating MIMO Connections

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Ultra-Miniature Overmolded Reed Switch Solution for Space-Constrained Designs

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Microchip Launches New dsPIC DSC-Based Integrated Motor Drivers That Bring Controllers, Gate Drivers & Communications To A Single Device

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Third Industrial Ethernet Week Focuses On Generative AI In Manufacturing Use Cases

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Latest Littelfuse Ultra Miniature 7 mm Reed Switches Provide High Reliability Longer Life Cycles

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Microchip Launches 10 Multi-Channel Remote Temperature Sensors

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Next-Generation Multizone Time-Of-Flight Sensor From STMicroelectronics Boosts Ranging Performance & Power Saving

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Transmitter & Receiver Evaluation Boards From STMicroelectronics Accelerate Development Of Qi Wireless Chargers

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Nexperia’s First SiC MOSFETs Raise The Bar For Safe, Robust & Reliable Power Switching In Industrial Applications

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STMicroelectronics Introduces AI-Enabled Automotive Inertial Measurement Unit For Always-Aware Applications Up To 125°C

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STMicroelectronics Accelerates Edge AI Adoption To Help Companies Transform Their Products

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Unique Rohde & Schwarz 170 GHz Power Sensors Ease Use & Traceability In The D-Band

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Eoxys Launches Market-Ready Ultra Low Power NB-IoT ML SOM Module for Building Intelligent and Secure IoT Devices

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Teledyne FLIR Expands Lepton Thermal Camera Series With An Ultra-Wide 160-degree Field Of View

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4.3 Inch Wall-Mounted Touch Display Module

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Halonix Technologies Launches India’s First ‘UP-DOWN GLOW’ LED Bulb

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5W DC/DC In DIP24 Package Has 4:1 Input Range

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Communicative Mini Controllers

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New 32-Bit MCU Features An Embedded Hardware Security Module To Safeguard Industrial & Consumer Applications

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TRI Launches New High-Performance 3D AXI

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Microchip FPGAs Speed Intelligent Edge Designs & Reduce Development Cost & Risk With Tailored PolarFire FPGA 7 SoC Solution Stacks

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Rohde & Schwarz Continues To Drive Early 6G & Sub-THz Research With New Dedicated W & D Band Test Solutions

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BorgWarner To Integrate STMicroelectronics’ SiC Technology In Viper Power Module For Volvo Cars’ Next-Generation EVs

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