HomeElectronics NewsCompact high-voltage chokes for EMI control

Compact high-voltage chokes for EMI control

Chokes help reduce EMI and save space, supporting high-voltage designs in power converters, motor drives, and power supplies.

TDK enables compact 1250 V DC converter designs with a new high-voltage common-mode choke
TDK enables compact 1250 V DC converter designs with a new high-voltage common-mode choke

TDK Corporation has launched the B82722V6*B040 series of compact, high-voltage, current-compensated ring-core double chokes designed to suppress EMI in systems operating up to 1250 V DC (630 V AC). The components target next-generation applications such as power converters, industrial motor drives, and switch-mode power supplies that use SiC and GaN semiconductors and run at higher DC bus voltages, where insulation coordination and PCB space are key concerns.

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The chokes come in a compact 23 × 15.5 × 24 mm package, helping reduce board space while maintaining insulation performance. The series covers inductance values from 3.3 mH to 22 mH and supports rated currents from 0.85 A to 3.0 A at an ambient temperature of +70 °C. A multilayer solid insulation structure, tested at 3,750 V (line-to-line), provides strong electrical isolation for high-voltage operation.

The use of an automated winding technique improves high-frequency performance and results in a typical stray inductance of around 0.6%, which helps suppress symmetrical interference. The ferrite core is coated with epoxy, and the plastic header meets UL 94 V-0 flammability standards. The design also complies with IEC 60938-2 and IEC/UL 60939-3 requirements for EMI chokes and filters.

Main features and benefits:

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  • Very high voltage rating
  • High resonance frequency due to special winding technique
  • Approx. 0.6% stray inductance for symmetrical interference suppression
  • Space-saving design
  • Suitable for wave soldering
  • Design complies with IEC 60938-2 (630 V AC, 50/60 Hz, PIII; 1250 V DC-link, PII)
  • RoHS-compatible

With a vertical design and compatibility with wave soldering, the series supports the development of 1250 V DC architectures without increasing PCB footprint.

Click here for the original announcement.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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