HomeElectronics NewsCompact high-voltage chokes for EMI control

Compact high-voltage chokes for EMI control

Chokes help reduce EMI and save space, supporting high-voltage designs in power converters, motor drives, and power supplies.

TDK enables compact 1250 V DC converter designs with a new high-voltage common-mode choke
TDK enables compact 1250 V DC converter designs with a new high-voltage common-mode choke

TDK Corporation has launched the B82722V6*B040 series of compact, high-voltage, current-compensated ring-core double chokes designed to suppress EMI in systems operating up to 1250 V DC (630 V AC). The components target next-generation applications such as power converters, industrial motor drives, and switch-mode power supplies that use SiC and GaN semiconductors and run at higher DC bus voltages, where insulation coordination and PCB space are key concerns.

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The chokes come in a compact 23 × 15.5 × 24 mm package, helping reduce board space while maintaining insulation performance. The series covers inductance values from 3.3 mH to 22 mH and supports rated currents from 0.85 A to 3.0 A at an ambient temperature of +70 °C. A multilayer solid insulation structure, tested at 3,750 V (line-to-line), provides strong electrical isolation for high-voltage operation.

The use of an automated winding technique improves high-frequency performance and results in a typical stray inductance of around 0.6%, which helps suppress symmetrical interference. The ferrite core is coated with epoxy, and the plastic header meets UL 94 V-0 flammability standards. The design also complies with IEC 60938-2 and IEC/UL 60939-3 requirements for EMI chokes and filters.

Main features and benefits:

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  • Very high voltage rating
  • High resonance frequency due to special winding technique
  • Approx. 0.6% stray inductance for symmetrical interference suppression
  • Space-saving design
  • Suitable for wave soldering
  • Design complies with IEC 60938-2 (630 V AC, 50/60 Hz, PIII; 1250 V DC-link, PII)
  • RoHS-compatible

With a vertical design and compatibility with wave soldering, the series supports the development of 1250 V DC architectures without increasing PCB footprint.

Click here for the original announcement.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at EFY with a deep interest in embedded systems, development boards and IoT cloud solutions.

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