Monday, October 7, 2024

Compact Module Provides 39 TOPS AI Performance

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The modules are positioned as a versatile solution for high-performance edge computing, AI inference, and graphics-intensive applications.

Congatec has introduced new COM Express Compact Computer-on-Modules powered by AMD Ryzen Embedded 8000 Series processors. These modules, named conga-TCR8, are built with up to eight ‘Zen 4’ cores, an AMD XDNA NPU, and Radeon RDNA 3 graphics, offering high performance for AI-driven applications with processing power up to 39 tera operations per second (TOPS) for AI inference.

The new modules are designed for applications that require a combination of advanced AI, graphics, and computing power, making them suitable for sectors like medical imaging, test and measurement, AI-supported POS/POI systems, and professional gaming. The modules provide long-term availability, ensuring investment security while also offering scalability with a thermal design power (TDP) range of 15 to 54 watts. These modules allow for easy upgrades of existing systems by replacing older modules, improving lifecycle and return on investment (ROI).

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Key specifications include 

  • Up to 8 Zen 4 cores
  • Size: 95 x 95 mm (3,74″ x 3,74″)
  • Up to 128 GB RAM (optional with ECC)
  • TDP ranges from 15W to 54W
  • Onboard NVMe SSD (option)

The modules also feature AMD’s XDNA NPU and Radeon RDNA 3 graphics, which support AI tasks and immersive graphics output on up to four 8K displays. For connectivity, the modules offer six PCIe Gen 4 lanes, multiple USB ports, DisplayPort interfaces, and SATA options, with an onboard NVMe SSD available as an option. The company’s ecosystem supports these modules with a range of services, including pre-installed operating systems such as Ubuntu or RT Linux and system consolidation features. This includes a ready-to-use option for custom applications through the aReady.COMs platform. 

Additionally, the company offers board support packages, evaluation and carrier boards, cooling solutions, and extensive design-in services to simplify integration and accelerate time-to-market. For more information, click here.

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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