Tuesday, April 23, 2024

Compact Schottky Diodes In CFP3-HP Packaging For Automotive And Industrial Use

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Engineered for versatility across a wide range of applications, such as DC-DC conversion and reverse polarity protection, these diodes boast superior heat dissipation capabilities within a minimal footprint. 

Nexperia has recently expanded its product lineup with the introduction of 22 new planar Schottky diodes, housed in the compact CFP3-HP packaging. This new range includes 11 industrial-grade products and 11 products that meet the stringent AEC-Q101 standards, indicating their suitability for automotive applications. This launch aligns with the industry’s shift towards smaller, more efficient packaging solutions, such as the CFP (Copper-clip Flat Power) package, particularly in applications like automotive, where space is at a premium.

These diodes are designed for various applications, including DC-DC conversion, freewheeling, reverse polarity protection, and OR-ing, showcasing their versatility in electronic circuit design. The key features include:

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  • Devices offer a range of maximum reverse voltages (VR(max)) from 30 V to 100 V.
  • Average forward currents (IF(average)) vary between 1 A and 3 A, catering to different design needs.
  • The compact CFP3-HP package dimensions are 3.7 mm x 1.8 mm x 0.9 mm.
  • Features an exposed heatsink for enhanced heat dissipation.
  • Ideal for applications needing high thermal performance in a small footprint.

The adoption of the company’s proprietary copper clip design in these diodes addresses the need for efficient and space-saving designs in modern electronic devices. CFP packaging, which is already utilized across various power diode technologies including Schottky and recovery rectifiers, and is extendable to bipolar transistors, demonstrates the versatility and innovation that the company brings to the semiconductor industry. This launch not only enhances its extensive portfolio but also strengthens its position as a packaging innovator, offering the widest selection of device options from a semiconductor manufacturer with a reliable supply chain.

Frank Matschullat, Product Group Manager Power Bipolar Discretes at Nexperia, emphasized the company’s commitment to leading the transition to smaller packaging solutions. He highlighted Nexperia’s significant investments in expanding production capacity to meet the growing demand for CFP-packaged products, aiming to exceed market expectations over the next three years. With these new diodes, Nexperia adds to its comprehensive offering of over 270 CFP-packaged products, underscoring its dedication to packaging innovation.

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Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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