Sunday, May 19, 2024

Micro-power Wi-Fi system For IoT Connectivity

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The dual-band Wi-Fi chip for IoT devices offers enhanced range, superior data transfer rates, and 88% reduced power consumption with direct cloud connectivity.


Qualcomm has launched the QCC730 Wi-Fi chip, designed to enhance range and data transfer rates while significantly reducing power consumption and offering direct cloud connectivity. This dual-band Wi-Fi chip is particularly suitable for IoT devices, boasting an 88% reduction in power usage per data transfer compared to its predecessors. It supports direct cloud connectivity and integrates with Matter, featuring an open-source SDK and IDE which facilitates cloud connectivity offloading.

The chip is suitable for a range of applications including smart home devices, wearable technology, industrial sensors, and other connected devices that benefit from efficient power usage and robust connectivity options. It is engineered as a 1×1 Wi-Fi 4 transceiver that provides ultra-low micro-power Wi-Fi, scalability, and design versatility. With selectable power modes and advanced power management, it significantly extends the battery life of IoT devices, whether they are battery-powered or energy-harvested.

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Moreover, the chip can function in both hosted and hostless modes and supports the use of both internal and external power amplifiers. It also features integrated, non-volatile memory which enhances its adaptability for various application needs. The fully integrated on-chip microcontroller, NVM, and SRAM simplify the design process, allowing developers to seamlessly integrate or replace traditional Bluetooth-only applications.

Supported by an open-source software SDK available on CodeLinaro, the QCC730 includes a Qualcomm Connectivity Integrated Development Environment based on Microsoft Visual Studio Code (VSCode). This environment is further enriched with a specific VSCode extension plugin for the chip, released as open-source software to enable customized development environments. Modules optimized for size and cost, along with corresponding development kits, are available from Qualcomm Authorized Design Centers to accelerate the productization process and market entry.

Overall, the QCC730 chipset revolutionizes IoT connectivity with its low power consumption and versatile design, offering a comprehensive solution that includes full-stack cloud connectivity capabilities. This makes it a powerful alternative for developers looking to enhance IoT device performance and connectivity.

For more information, click here.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a journalist at EFY. She is an Electronics and Communication Engineer with over five years of academic experience. Her expertise lies in working with development boards and IoT cloud. She enjoys writing as it enables her to share her knowledge and insights related to electronics, with like-minded techies.


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