Saturday, February 24, 2024

Compact SoM For Edge AI And 5G Applications

By Nidhi Agarwal

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The System on Module, designed for FPGA, edge AI, 5G, and image processing, features dual-core technology and supports various communication and industrial applications.

SoM

The iWave announces the launch of the iW-RainboW-G58M System on Module (SoM), using the Intel Agilex 5 FPGA Series for midrange FPGA applications. This SoM, sized at 60mm x 70mm, supports the Intel Agilex 5 FPGA and SoC E-Series family and the B32A package, which are offered in two device variants.

The SoM is suitable for wireless communications, video/broadcast, and industrial test and measurement devices. It supports 24 transceivers up to 28 Gbps, has a PCIe Gen 4 interface, and includes a 2.5 Gigabit Ethernet PHY transceiver. 

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Intel Agilex 5 FPGAs and SoCs build upon the industry’s AI tensor block from Intel’s previous FPGA for mid-range applications, making them suitable for edge AI applications. The FPGA series has a dual Arm Cortex-A76 and Cortex-A55 core asymmetric applications processor system, enhancing performance and power efficiency for various workloads.

Some of the key features of the SoM include:

  • Agilex® 5 E- Series family with B32A Package
  • Dual-core 64-bit Arm Cortex-A76 up to 1.8 GHz
  • Dual-core 64-bit Arm Cortex-A55 up to 1.5 GHz
  • Up to 656K Logic cells
  • 32Bit 4GB LPDDR4 for HPS
  • Dual 32Bit 4GB LPDDR4 for FPGA
  • 32GB eMMC (Expandable)
  • 1Gb QSPI Configuration flash
  • Up to 2.5G Ethernet
  • 24 x transceivers up to 28Gbps
  • FPGA HSIO (Up to 48 LVDS/96 SE)
  • FPGA HVIO (Up to 100)
  • Compact Form Factor: 60mm x 70mm
  • Industrial-grade support

“Exciting to see the launch of the Intel Agilex® 5 FPGA, which extends the innovations of the Intel Agilex® FPGA portfolio to midrange FPGA applications, delivering high-efficiency AI and DSP functionality,” said Immanuel Rathinam, Vice President – System on Modules at iWave. “The Intel Agilex® 5 FPGA powered System on Module provides an optimal balance in performance and power for advanced image processing, 5G wired/wireless, and edge AI applications while accelerating customers’ time to market with reduced complexity and risk.”

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