Monday, June 24, 2024

Compact SoM For Edge AI And 5G Applications

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The System on Module, designed for FPGA, edge AI, 5G, and image processing, features dual-core technology and supports various communication and industrial applications.


The iWave announces the launch of the iW-RainboW-G58M System on Module (SoM), using the Intel Agilex 5 FPGA Series for midrange FPGA applications. This SoM, sized at 60mm x 70mm, supports the Intel Agilex 5 FPGA and SoC E-Series family and the B32A package, which are offered in two device variants.

The SoM is suitable for wireless communications, video/broadcast, and industrial test and measurement devices. It supports 24 transceivers up to 28 Gbps, has a PCIe Gen 4 interface, and includes a 2.5 Gigabit Ethernet PHY transceiver. 

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Intel Agilex 5 FPGAs and SoCs build upon the industry’s AI tensor block from Intel’s previous FPGA for mid-range applications, making them suitable for edge AI applications. The FPGA series has a dual Arm Cortex-A76 and Cortex-A55 core asymmetric applications processor system, enhancing performance and power efficiency for various workloads.

Some of the key features of the SoM include:

  • Agilex® 5 E- Series family with B32A Package
  • Dual-core 64-bit Arm Cortex-A76 up to 1.8 GHz
  • Dual-core 64-bit Arm Cortex-A55 up to 1.5 GHz
  • Up to 656K Logic cells
  • 32Bit 4GB LPDDR4 for HPS
  • Dual 32Bit 4GB LPDDR4 for FPGA
  • 32GB eMMC (Expandable)
  • 1Gb QSPI Configuration flash
  • Up to 2.5G Ethernet
  • 24 x transceivers up to 28Gbps
  • FPGA HSIO (Up to 48 LVDS/96 SE)
  • FPGA HVIO (Up to 100)
  • Compact Form Factor: 60mm x 70mm
  • Industrial-grade support

“Exciting to see the launch of the Intel Agilex® 5 FPGA, which extends the innovations of the Intel Agilex® FPGA portfolio to midrange FPGA applications, delivering high-efficiency AI and DSP functionality,” said Immanuel Rathinam, Vice President – System on Modules at iWave. “The Intel Agilex® 5 FPGA powered System on Module provides an optimal balance in performance and power for advanced image processing, 5G wired/wireless, and edge AI applications while accelerating customers’ time to market with reduced complexity and risk.”

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a journalist at EFY. She is an Electronics and Communication Engineer with over five years of academic experience. Her expertise lies in working with development boards and IoT cloud. She enjoys writing as it enables her to share her knowledge and insights related to electronics, with like-minded techies.


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