Sunday, July 14, 2024

High Heat Resistant Flexible Printed Circuit Board For Extreme Environments

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This FPC boasts good heat resistance, upgraded insulating layers, and remarkable adaptability, setting a new standard for performance in extreme conditions.

Yamaichi Electronics has introduced an enhanced version of its YFLEX flexible printed circuit board (FPC) tailored for extreme environments, addressing the rigorous demands of industries like automotive, semiconductor manufacturing, and test and measurement technology. This cutting-edge FPC offers remarkable heat resistance, improved insulating layers, and versatile adaptability to diverse applications.

The standout feature is its upgraded insulating layer, exhibiting enhanced adhesion due to incorporating a specialised cover layer. The key features are:

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  • FPC (Flexible Printed Circuit) can withstand extreme temperatures up to 150°C.
  • Electrical properties of the FPC are maintained for over 3,000 hours at these high temperatures.
  • Continuity resistance remains consistent within a rate of change of ±10%.
  • Insulation resistance remains impressive at 500 MΩ or higher, even under extreme temperature conditions.

This remarkable resistance ensures the dependable performance of the FPC even in the harshest environments, where conventional circuits may falter.

One of the key advantages is its adaptability, making it suitable for a wide range of applications. It can be manufactured in single- and double-layer configurations to meet varying needs. The choice of insulation substrate base materials includes liquid crystal polymer (LCP) and polyimide (PI), allowing for optimal customisation to suit different application requirements. Moreover, the FPC features a reinforced GND (ground) design that not only enhances its suitability for high-heat-resistant applications but also makes it highly effective in combating noise-related issues.

This High-Heat Resistant FPC represents a significant leap forward in flexible printed circuit board technology. Its exceptional heat resistance, improved insulating layers, and adaptability to diverse applications make it a game-changer in industries where reliable performance under extreme conditions is paramount. With global availability, this innovation is set to profoundly impact various sectors, ensuring the continued advancement of technology in the face of extreme challenges.

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.


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