Friday, December 5, 2025

High-Speed Inductor For AI Data Centers

A new inductor separates signals from power, reduces power loss and heat, and manages signal flow in optical transceivers for AI data centers.

The actual appearance of the product differs from the image.
TDK logo is not stamped on the actual product.
The actual appearance of the product differs from the image. TDK logo is not stamped on the actual product.

TDK Corporation has expanded its PLEC69B series of thin-film inductors, used to separate data signals from power in optical transceivers for AI data centers. Mass production of these components began in August 2025.

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The PLEC69B is used in bias-tee circuits in optical transceivers, where it separates the signal from power, preventing the signal from flowing into the power line due to impedance differences. This ensures high-speed, high-capacity communication in AI data centers, which are seeing rapidly increasing demand.

The inductor achieves the highest standard performance* for a 10 μH inductor in 1206 size, using TDK’s proprietary metallic magnetic materials and structural designs. It has a wide frequency range of 10 MHz to 200 MHz, providing high impedance for effective signal separation. Its DC resistance is 1.4 Ω, approximately 70% lower than similar products, reducing power loss and heat generation. The rated current (Isat) of 0.2 A is 1.7 times higher than comparable products. Its smaller dimensions save PCB space, and it maintains high reliability with an upper operating temperature limit of +125 °C.

The PLEC69B is suitable for signal circuits such as bias-tee circuits for optical communication modules, and for power supply circuits in smartphones, TWS, and wearable devices. Its features and benefits include high impedance characteristics over a wide frequency range, reduced DC resistance of 1.4 Ω to lower power loss and heat, and a rated current of 0.2 A, increased by 1.7 times compared with similar products.

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TDK will continue developing products to meet market needs for lower power consumption and high-speed communication. Its lineup supports data centers, servers, optical communication devices, and edge devices, contributing to the AI market in anticipation of significant future growth.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at EFY with a deep interest in embedded systems, development boards and IoT cloud solutions.

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