The first UFS Version 4.0 devices for automotive applications offer storage transfer speeds and reliability and are suitable for telematics, infotainment systems, and ADAS.
Kioxia Corporation announced the sampling of the industry’s first Universal Flash Storage (UFS) Version 4.0 embedded flash memory devices for automotive applications. These devices offer performance, providing storage transfer speeds in a package suitable for automotive applications such as telematics, infotainment systems, and Advanced Driver Assistance Systems (ADAS). The performance of Kioxia’s UFS products, including an increase in sequential read speed and an increase in sequential write speed, enables these applications to leverage the connectivity benefits of 5G, resulting in system startup times and a user experience.
As the pioneer in UFS technology, the company claims to advance this technology. It’s the new UFS Ver. 4.0 devices incorporate the company’s BiCS FLASH 3D flash memory and a controller within a JEDEC-standard package. UFS 4.0 integrates MIPI M-PHY 5.0 and UniPro 2.0, supporting interface speeds of up to 23.2 gigabits per second (Gbp/s) per lane or 46.4 Gbp/s per device. UFS 4.0 is also backwards compatible with UFS 3.1.
The new devices support the High-Speed Link Startup Sequence (HS-LSS) feature, enabling a Link Startup (M-PHY and UniPro initialization sequence) between the device and host at an HS-G1 Rate A (1248 megabits per second), which is expected to reduce the time for Link Startup by compared to conventional UFS.
The UFS Version 4.0 devices are equipped with features and functionalities tailored to the demands of automotive applications. These include a Refresh Feature that enhances data reliability by refreshing degraded data to prevent corruption within the in-vehicle environment. Additionally, an Extended Diagnosis Feature allows users to access important information from the UFS device, enabling them to take preventative measures to ensure optimal performance and longevity.
The devices are available in capacities of 128, 256, and 512 gigabytes (GB) and are designed to support a wide temperature range. They meet the AEC-Q100 Grade 2 requirements and provide the enhanced reliability capabilities necessary for complex automotive applications.
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