HomeElectronics NewsMemory Chip Aims to Speed Up AI

Memory Chip Aims to Speed Up AI

AI memory chips help servers and data centres run AI workloads faster, process more data, and use less power. 

SK hynix Ships Samples of 12-Layer Next-Gen ‘HBM4E’
SK hynix Ships Samples of 12-Layer Next-Gen ‘HBM4E’

SK hynix has shipped samples of its 12-layer HBM4E, its next-generation high-bandwidth memory (HBM) for AI applications, to major customers. The company plans to work with customers to prepare the product for mass production.

The HBM4E memory delivers data transfer speeds of up to 16Gbps per pin while improving power efficiency by more than 20% compared to the previous generation. The higher speed and lower power consumption are designed to support AI training, AI inference, and other data-intensive workloads.

The memory is intended for AI chipmakers, server manufacturers, cloud service providers, and companies building AI data centres and high-performance computing (HPC) systems. They can use it to build AI accelerators and servers that process larger AI models, train models faster, run AI inference more efficiently, and handle larger volumes of data while reducing power consumption.

The memory also reduces data transfer latency through an updated interface and design improvements while maintaining stable performance in high-bandwidth computing environments. This helps improve data processing efficiency in AI data centres and large-scale computing systems.

To build the 12-layer stack, SK hynix uses its Advanced MR-MUF (Mass Reflow Molded Underfill) packaging process, which injects protective material between stacked memory chips. The technology enables a 48GB capacity while maintaining structural stability. The company also said the new memory offers 17% better heat resistance than its HBM4 product, allowing stable operation in high-performance computing systems.

“SK hynix has laid the foundation to strengthen its AI leadership with HBM4E based on its market-leading technological capabilities and manufacturing expertise,” said Ahn Hyun, President and Chief Development Officer, adding, “Through close collaboration with our partners, we will deliver the value needed in the market while reinforcing our technology leadership as a full-stack AI memory creator.”

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Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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