Wednesday, April 17, 2024

New High-Speed 3D Solder Paste Inspection Solution

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Built on the award-winning TR7007 SII Plus Series, the new equipment can accurately inspect low solder bridges

Test Research, Inc. (TRI) presents the new 3D high-speed solder paste inspection (SPI) solution TR7007 SII Ultra that can perform at an industry-leading speed of up to 180 cm2/sec.

The TR7007 SII Ultra is built on the highly popular and award-winning TR7007 SII Plus Series. The development has been enhanced with a mechanical platform to guarantee stability, accuracy and precision during the inspection. The TR7007 SII Ultra can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.

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TRI’s systems are designed to interoperate with other manufacturing equipment to minimise downtime, optimise production quality and reduce operator workload.

Realise your production line’s potential with TRI’s PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0.


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