Powered by EDT2 (Electric Drive Train) technology, the device ensures lower losses and higher efficiency at low-load conditions
Optimised for inverter applications in hybrid and electric vehicles, the new automotive-qualified EasyPACK 2B EDT2, a half-bridge power module by Infineon Technologies AG can reach a maximum power of up to 50 kW and 230 Arms (depending on inverter conditions).
The presence of EDT2 (Electric Drive Train) technology and full automotive qualification allows the device’s application range to include traction inverters. A key feature of the EDT2 technology is the higher efficiency at low-load conditions. An EDT2 chip ensures significantly lower losses than other similar products and even outperforms Infineon’s previous chip generation by 20 per cent.
Another unique feature of EasyPACK is its plug-and-play approach, which simplifies module integration. Compared to classic through-hole discrete packages as well as the Infineon’s HybridPACK 1, pin soldering is not required. Infineon’s PressFIT contact technology reduces the mounting time. Thanks to the package size, three EasyPACK 2Bs require 30 per cent less surface area than a HybridPACK 1. For this reason, they offer not only a very compact design but are also cost-effective. Furthermore, the EasyPACK 2B EDT2 is fully qualified to the AQG324 standard.
The new EasyPACK 2B EDT2 module FF300R08W2P2_B11A will be available from Infineon Technologies AG from October 2021.