New Versatile Solder Paste That Can Meet Current And Emerging Needs

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It is a no-clean, halogen-free solder paste that is useful in applications requiring precision dot diameter/line width deposits

An innovative and versatile solder paste that delivers exceptional jetting and microdispensing performance on a variety of systems to meet a customer’s current and emerging needs is the new Indium12.8HF introduced by Indium Corporation

It is a no-clean, halogen-free solder paste that is inherently compatible with the Indium8.9HF, solder paste—the manufacturer’s best-selling product. Originally formulated for micro-LED applications, Indium12.8HF has proven to be useful in a wide range of applications requiring precision dot diameter/line width deposits down to 80μm.

Additionally features:
⦁ Meets IPC J-STD-004B with Amendment 1 ROL0 requirements
⦁ Offers exceptional electrical reliability
⦁ Minimises graping and similar reflow issues with a unique flux oxidation barrier formulation
⦁ Delivers aesthetically pleasing clear residue with minimal flow-out
⦁ Provides minimal reflow spatter compared to similar solder pastes
⦁ Long working (syringe) life


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