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 Soldering is one of the most important processes in the manufacturing of any electronics module, and to enhance the strength of soldering joint and create smooth solder joints, SHENMAO America, Inc. has released an enhanced Solder Joint Encapsulation Material...
Emil Otto GmbH and Feinhütte Halsbrücke GmbH have released new flux-filled high-performance solder wires. These micro-alloyed solders are said to significantly reduce copper leaching and have an oxidation-inhibiting effect. The basis is two soft solder alloys filled with the...
Flux is a water based paste that contains a cleaning agent, activator, and wetting agent used in soldering to remove oxides from the area to be soldered. A good flux cleans the area to be soldered and allows the...
It is a no-clean, halogen-free solder paste that is useful in applications requiring precision dot diameter/line width deposits An innovative and versatile solder paste that delivers exceptional jetting and microdispensing performance on a variety of systems to meet a customer's...
Enhanced with thermal cycling performance for high-temperatures and provides advanced lifetime in many automotive applications Indium Corporation, a supplier of materials for electronics, semiconductor, thin-film and thermal management applications, has released a new high-reliability alloy, the Indalloy 292 that is...
 
 

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