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Monday, May 16, 2022
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Indium Corporation is announcing the release of InTACK, a drop-in, robust tacking agent for power module assembly at PCIM Europe, May 10-12, Nuremberg, Germany. InTACK is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during...
WS-3910 is a water-soluble, halogen-free flip-chip flux that is designed for low-temperature—150°C—bismuth-tin applications. WS-3910 is chemically designed to exhibit minimal evaporation after application. Its composition also eliminates compatibility underfills by having a completely water-cleanable residue. WS-3910: Features low evaporation after application,...
Indium Corporation announces that it is now offering supplemental bar alloys for Indalloy291 wave solder pots designed to maintain recommended solder pot specifications.  The supplemental bar and bar chips are added to Indalloy291-containing solder pots that have fallen below or...
Indium Corporation announces that it is now offering CW-305, a uniquely formulated flux-cored wire that offers superior ease of cleaning in which the post-soldering residue can be removed by using only a warm water-wash. Indium Corporation’s halogen-free CW-305 cleans so...
It is a no-clean, halogen-free solder paste that is useful in applications requiring precision dot diameter/line width deposits An innovative and versatile solder paste that delivers exceptional jetting and microdispensing performance on a variety of systems to meet a customer's...
It has tack strength to hold materials in place and is near-zero residue adhesive solution, allowing complete evaporation during reflow Designed for holding parts in place during placement and use in formic acid reflow environment is the NC-202, a no-clean,...
Eliminates flux spattering that can cause burn injuries, impair the vision system or make finished products less aesthetically appealing Here's offering a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter performance. The CW-232 is a...
Enhanced with thermal cycling performance for high-temperatures and provides advanced lifetime in many automotive applications Indium Corporation, a supplier of materials for electronics, semiconductor, thin-film and thermal management applications, has released a new high-reliability alloy, the Indalloy 292 that is...
Indium Corporation's new ball-attach flux allows printing and pin transfer for small sphere and high-density applications The flux is water-soluble and halogen-free that can be used for ball-attach on a substrate in a standard ball-grid array (BGA) manufacturing process Indium...
 
 

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