Power-Saving 3D Magnetic Sensor In Highly Compact Package

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  • Infineon Technologies’ latest sensor offering has high-accuracy and robustness against rugged external conditions
  • Available in a highly small size, the sensor is suitable for use in space-critical applications

Infineon Technologies has announced that it will be expanding its XENSIV™ 3D magnetic sensor family TLx493D with the addition of the TLI493D-W2BW. It uses the latest 3D Hall generation technology.

Due to its small size and low current consumption of 7 nA in power-down mode, the new magnetic sensor is suitable for use in applications that previously used resistor-based or optical solutions. Magnetic sensors offer numerous advantages in the form of high accuracy and robustness against dust and moisture. Additionally, magnetic sensors are easier to assemble and offer more design options.

The sensor’s low height is helpful in extremely space-critical applications such as BLDC commutation in micromotors or control elements such as joysticks or game consoles. It enables designs with double-sided PCBs or positioning of the sensor between two PCBs. This allows optimal use of the available space so that additional components can be placed above the sensor.

Other technical features

  • Integrated wake-up function (in four variants with preconfigured standard addresses).
  • A high resolution (typically 32.5 to 130 µT/LSB12).
  • Support for XY angle measurement.
  • Update rate is up to 5.7 kHz (8.4 kHz for XY)
  • Adjustable resolution in low-power modes between 0.05 and 770 Hz.
  • Power consumption in power-down mode is 7 nA
  • Supply current is 3.4 mA.
  • Has an I2C interface and a dedicated interrupt pin.

The sensor is housed in a small wafer-level (WLB-5 package) with dimensions 1.13 mm x 0.93 mm x 0.59 mm. It has 87 per cent smaller footprint and 46 per cent less height than previous comparable products. Samples of the new XENSIV 3D sensor TLI493D-W2BW are already available. Series production will start in August 2020.


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