Tired of large power systems and complex circuits? Find out a new module that makes industrial circuits smaller, faster, and easier to build.
Many industrial applications face challenges in improving power density, reducing size, and simplifying circuit design while handling higher voltages. This is true for systems like PV inverters, UPS, semiconductor relays, ePTO, boost converters for FCVs, AI servers (eFuse), and EV charging stations. Using discrete SiC modules in multi-level circuits leads to large designs, complex layouts, and limits in efficiency due to structural and thermal constraints.
To solve these problems, ROHM has developed the “DOT-247,” a 2-in-1 SiC molded module, for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the structure of the “TO-247” package while achieving design flexibility and power density.
The DOT-247 has a combined structure of two TO-247 packages. This design allows the use of large chips, which were hard to fit in the TO-247 package, and achieves low on-resistance through an internal structure. Through optimized package structure, thermal resistance has been reduced by about 15% and inductance by about 50% compared to the TO-247. This enables power density 2.3 times higher than the TO-247 in a half-bridge configuration – achieving the same power conversion circuit in about half the volume.
The new products with the DOT-247 package are available in two topologies: half-bridge and common-source. Two-level inverters are common in PV inverters, but there is growing demand for multi-level circuits such as three-level NPC, three-level T-NPC, and five-level ANPC to meet the need for higher voltages. In the switching sections of these circuits, topologies such as half-bridge and common-source are mixed – making custom products necessary in many cases when using conventional SiC modules.
To address this challenge, ROHM developed each of these two topologies – the smallest building blocks of multi-level circuits – into a 2-in-1 module. This enables flexibility to support various configurations such as NPC circuits and DC-DC converters, while reducing the number of components and mounting area, and achieving circuit miniaturization compared to discrete components.
Application examples include PV inverters, semiconductor relays, UPS (uninterruptible power supply), ePTO, and boost converters for FCVs (fuel cell vehicles), as well as AI servers (eFuse), EV charging stations, and more.
