Offers high accuracy, fast speeds and minimised downtime using deep learning, thereby reducing human errors, false calls and operator costs
The newly released 3D SPI TR7007Q Plus by Test Research Inc. (TRI) is equipped with an improved motion controller and enhanced 2D lighting for sharper inspection images. The AI-powered 3D AOI TR7700Q SII has an unprecedented 1μm Resolution for High Accuracy, industry-leading speed of up to 57cm2/sec and flexible algorithms. Along with these, the high-end 3D AXI TR7600F3D SII and the Multi-core ICT TR5001Q SII INLINE is capable of 24×7 inspection optimisation using deep learning, thereby reducing human errors, false calls and operator costs.
Also, TRI’s PCBA Test and Inspection solutions and Industry 4.0 data-driven management system, YMS 4.0 are designed to interoperate with other manufacturing equipment to minimise downtime, optimise production quality and reduce operator workload.
Test Research Inc. (TRI) will be showcasing the above test and inspection systems for the electronics manufacturing industry at the NEPCON China held at Shanghai World Expo Exhibition & Convention Center from April 21 – 23, 2021.
