Hidden defects inside electronics are harder to catch than ever—X-ray inspection is changing how manufacturers detect problems before products fail.
BGA Technology has expanded its electronics inspection capabilities with the installation of a Creative Electron TruView Simplex X-ray system at its Holbrook, New York facility, strengthening its ability to inspect complex assemblies used in high-reliability applications.
The system enables BGA Technology’s engineering team, electronics manufacturers, OEMs, and customers in aerospace, defense, medical, industrial, and other mission-critical industries to perform high-resolution, non-destructive inspection of BGAs, QFNs, and other concealed solder joints that cannot be evaluated through conventional inspection methods. Using the system, teams can identify defects such as solder voiding, insufficient solder, cracked joints, and component misalignment, while also supporting root-cause analysis, process validation, and production quality control.
The TruView Simplex platform combines advanced imaging with fast analysis and simplified operation, allowing BGA Technology to deliver more efficient inspection services for prototype development, manufacturing verification, rework evaluation, and failure analysis. The system also helps manufacturers improve traceability and reduce the risk of field failures by identifying hidden defects before products move into deployment.
As demand grows for reliable electronics in aerospace, defense, and other high-reliability sectors, advanced X-ray inspection has become increasingly important for maintaining process control and product quality. The addition of the TruView Simplex system expands BGA Technology’s ability to support customers requiring precision inspection, faster analysis, and more robust quality assurance processes.
“We continue to invest in the tools and technology needed to support our customers at the highest level,” said Jayanth Kygonhalli, CTO, BGA Technology. “The addition of this Creative Electron system allows us to deliver faster, more accurate analysis and further reinforces our commitment to quality and reliability.”
