Home Electronics News The Future Of Solder Resist Technology With Reflow 1.8

The Future Of Solder Resist Technology With Reflow 1.8

0
The Future Of Solder Resist Technology With Reflow 1.8

A revolutionary phase where expert knowledge fuses with advanced technology, ensuring enhanced durability and safeguarding of printed circuit boards.

In a strategic move forward, Peters unveils its latest acquisition – the Reflow 1.8 soldering machine from SEHO, paving the way for quality and innovation in the solder resist technology. This machine aims to test the resilience and efficiency of high-end solder rigorously resists before they make their way to the clients.

The Reflow 1.8 machine is a quality assurance and forward-thinking investment, encapsulating a new era of technological prowess. This involves subjecting coated substrates and circuit boards to extreme temperature stress, simulating the conditions the coatings would undergo in industrial applications. It’s a stringent test of endurance, where only the most coatings survive, promising durability and protection for the respective PCBs(printed circuit boards).

The performance of coatings under temperature stress speaks about their resilience. This machine helps to certify that the coatings are resistant and robust enough to guarantee long-lasting protection. Boosting its testing capabilities, the machine can heat the coated parts to 320° Celsius, utilising an array of ten radiators distributed over two levels. The indicators of the trial are clear – no cracks or colour alterations post the heat bath. This denotes creating special coating systems for electronics.

The company claims that the system represents an advancement for their R&D efforts. It aligns perfectly with their forward-thinking approach to meeting customer needs. The machine weighs 900 kilograms and spans 3.20×1.25 x1.60 meters. Its design occupies nearly half the space it would in a typical industrial setting.