A miniaturised three-terminal component reduces PCB mounting area by 64%, helping designers maintain stable power delivery in space-constrained, high-performance electronic devices.
Murata Manufacturing has started mass production of its LLD series, three-terminal low-equivalent series inductance (ESL) multilayer ceramic capacitors (MLCCs), measuring just 0.6 × 0.3 mm. The components occupy approximately 64% less mounting area than the company’s previous smallest 0402-inch three-terminal capacitors, enabling more compact PCB layouts in smartphones, wearables and other space-constrained electronic devices.
The miniature capacitors are designed to stabilise power supply voltage near integrated circuits (ICs), particularly when high-speed operation causes rapid changes in current demand. Such fluctuations can affect the voltage supplied to ICs and compromise reliable operation. By reducing parasitic inductance, the components help maintain a stable power supply during high-frequency operation.
Unlike conventional two-terminal capacitors, three-terminal MLCCs provide four shorter current paths. This arrangement reduces equivalent series inductance, allowing the capacitors to respond more effectively to high-frequency noise and transient current demands. The resulting power stability can support reliable operation of increasingly powerful ICs in compact electronic systems.
The key features are:
- Three-terminal electrode configuration for reduced inductance.
- Four shorter current paths compared with conventional two-terminal designs.
- Optimised internal and external electrode structures.
- Designed for high-frequency power supply stabilisation near ICs.
- Mass-produced series based on advanced electrode design and manufacturing processes.
Miniaturising three-terminal MLCCs has been challenging because their internal and external electrode structures are more complex than those of conventional two-terminal components. Murata has addressed this through electrode design optimisation and improvements to manufacturing processes. The resulting 0201-inch components support high-density mounting while providing greater flexibility in component placement and circuit design around ICs.
The LLD series includes two models, both offering a capacitance of 1 µF. The LLD033R60G105ME01 has a rated voltage of 4 V DC and operates across temperatures from −55°C to +85°C. The LLD033D80E105ME01 supports a rated voltage of 2.5 V DC and a wider operating temperature range of −55°C to +105°C.
These components can help engineers optimise power distribution in smartphones, wearable electronics and other compact devices where PCB space is limited and stable voltage delivery is essential. Their reduced footprint allows designers to accommodate additional circuitry or optimise board layouts without sacrificing local power supply decoupling.
By combining a smaller package with low-ESL characteristics, the LLD series addresses two design priorities in modern electronics: board miniaturisation and reliable power delivery to high-speed ICs.
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