As part of the YAGEO Group and leading global electronic components supplier, KEMET announces its new SCF-XV series of AEC-Q200 qualified common mode chokes....
Congatec has introduced five new modules to its Xeon D-2700 processor-based Server-on-Module portfolio. The modules will satisfy the industry demands for edge server performance...
ADTF3175 from Analog devices is the industry’s first high-resolution module for 3D Depth sensing applications. The ADTF3175 uses indirect Time-of-Flight (iToF) tech module for...
AMD has announced the release of the 2nd generation of Ryzen Embedded R2000 Processors. The mid-range system-on-chip (SoC) is optimized for a wide range...
MIT researchers have created insect-scale robots that can track motion and have the ability to communicate!
Taking inspiration from nature, they created electroluminescent soft artificial...
Computer and physical processes are meant to be seamlessly integrated in a cyber-physical system (CPS). Thus, computers and networks can keep track of the...
To enable next-generation connectivity of the 5G module, Quectel Wireless Solutions has integrated the company’s RM500Q with the Jetson AGX Orin. The company aims...
Innovative car cockpits, seamless connectivity with new services and improved passive safety: 3D depth sensors play a key role in monitoring systems in the...