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The new module gives Qseven designs a massive performance boost for the future by bringing modern machine learning and AI capabilities congatec celebrates the 15th anniversary of Qseven Computer-on-Modules with the introduction of the conga-QMX8-Plus, a brand new Qseven module...
IIoT edge computing platforms enable real-time Ethernet communication and act as the next step for accelerating smart factory scenarios congatec's latest IIoT edge computing platforms focus on supporting Time Sensitive Networking (TSN) to enable real-time Ethernet communication based on open...
The dedicated modular system management interface gives remote management access to embedded systems, OEMs and users PICMG, a consortium for developing open embedded computing specifications has released the COM-HPC Platform Management Interface (PMI) specification. It provides a framework of remote...
They have the capability to process massive workloads required in demanding IoT gateway and edge computing applications congatec has introduced 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro,...
Utilises an integrated Neural Processing Unit (NPU) and helps in developing next-generation of AI accelerated embedded vision systems congatec has extended its i.MX 8 ecosystem with a new starter set for AI accelerated intelligent embedded vision applications. Based on a SMARC...
Enables digitisation of healthcare that has the potential to radically change patient care and significantly reduce healthcare costs congatec presents the latest embedded computing and artificial intelligence (AI) technologies for medical imaging and diagnostics, operating theatres as well as mobile...
Enables highly rugged performance per watt improvements for reliable 24x7 operation in harsh environmental areas congatec has introduced the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to...
The new platforms support extreme temperature ranges, feature BGA soldered processors for shock and vibration as well as high EMI resistance congatec presents extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. The...
Reduced latency and minimized jitter in real-time synchronized processes can be achieved for tactile internet applications congatec has introduced new application-ready platforms for tactile internet applications over public broadband as well as private IP networks. They support Time Sensitive Networking...
The COM-HPC comes with latest high-speed interfaces and connectors, and comprehensive feature set for remote management Introducing the first carrier board and cooling solutions, building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are...