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Enables highly rugged performance per watt improvements for reliable 24x7 operation in harsh environmental areas congatec has introduced the conga-TCV2, a brand new COM Express Compact Computer-on-Module based on AMD Ryzen Embedded V2000 processors. With double the performance compared to...
The new platforms support extreme temperature ranges, feature BGA soldered processors for shock and vibration as well as high EMI resistance congatec presents extended temperature range platforms for all performance levels, from high-end COM-HPC to low power SMARC modules. The...
Reduced latency and minimized jitter in real-time synchronized processes can be achieved for tactile internet applications congatec has introduced new application-ready platforms for tactile internet applications over public broadband as well as private IP networks. They support Time Sensitive Networking...
The COM-HPC comes with latest high-speed interfaces and connectors, and comprehensive feature set for remote management Introducing the first carrier board and cooling solutions, building the foundation of the new ecosystem for the brand new PICMG COM-HPC standard. They are...
New modules come with 11th Gen Intel Core processors and are built for outdoor and in-vehicle applications congatec has introduced six new Computer-on-Modules with 11th Gen Intel Core processors for the extended temperature range. Built with high-quality components designed to...
Low-power processors provide a great computing and graphics performance, making them perfect for any non-real-time application congatec has launched Intel’s new low-power processor generation on five embedded form factors. To be made available on SMARC, Qseven, COM Express Compact and...
With PCIe Gen4, USB4 support and massively increased bandwidth, new modules offer significantly greater CPU performance and nearly 3x higher GPU performance congatec, a leading vendor of embedded and edge computing technologies has announced the launch of 12 brand new...
congatec's 11th Gen Intel core processor-based modules offer improved benefits for utilising high bandwidth interfaces at fast speeds The performance enhancements provide more compute power and power savings congatec has introduced its COM-HPC Client size A module and nex-gen...
congatec in cooperation with Intel has developed an IoT kit for vision-based collaborative robotics, automation controls and autonomous vehicles The RFP kit has three virtual machines (VMs), all equipped with Intel Xeon E2 processor and an Intel Arria...
Enables quick time-to-market and cost efficiency Equipped with complete support for Windows and RTS hypervisor Embedded computer technology developer, congatec, has launched the new conga‑SMC1/SMARC-x86 8.89 cm (3.5-inch) carrier board. The SMARC 2.1 carrier board is application-ready and deployable...