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Locations: Bengaluru and Chennai
Company: Microchip
About The Job
Division: Mixed-Signal Development Group, Advanced Engineering Services
Title: Senior-2, IC Package Engineer
The Mixed Signal Development Group is responsible for delivering analog and mixed-signal IP to divisions within Microchip. We work with leading edge CMOS processes to produce analog integrated circuits for storage and wireline applications. From T1/E1 to 56Gb/s SERDES, we enable technology that allows Microchip’s products to interface to the outside world.
As a member of the Mixed-Signal Development Group, the candidate will be supervised by a team leader/manager, and be engaged in the package design and layout.
Responsibilities
- Conduct package routing feasibility and layouts for Microchip high-speed products, including MCM packages
- Perform simple PCB breakout studies for ball map feasibility
- Identify key issues for proposed designs based on silicon floor plans and desired package sizes
- Work with signal integrity engineers to implement high-speed signal routes and quiet power routes
- Work with reliability engineers and external vendors to ensure manufacturability of package designs
- Create package routing constraints based on signal integrity routing rules
- Interact with and oversee work of external and internal package designers
- Produce package routing reports and diagrams for review by external teams
- Create and track package design schedules
- Guide and assist external design teams on the creation of input data for the package design flow.
Requirements/Qualifications:
- Applicable Bachelor’s or Master’s Degree
- 6+ years of industry experience
- Expert in package design using Cadence APD
- Expert in authoring APD design rules
- Scripting in PERL or SKILL is an asset
- Familiarity with flip-chip and wire-bond package designs
- Familiarity with PCB design and BGA fanout issues
- Understanding of high-speed and power routing rules/issues
- Capable of handling multiple tasks at once
- Customer-oriented, with attention to detail
