Wednesday, February 18, 2026
HomeElectronics NewsSmall Power Chips For Cars

Small Power Chips For Cars

Smaller, stronger, and built for tough car systems, these power devices promise better performance, reliable mounting, and space savings.

ROHM’s New Compact, Highly Reliable Package Added to
Automotive 40V/60V MOSFET Lineup
ROHM’s New Compact, Highly Reliable Package Added to Automotive 40V/60V MOSFET Lineup

ROHM has expanded its lineup of low-voltage (40V/60V) MOSFETs for automotive applications by introducing new products that adopt the HPLF5060 package. These devices are designed for use in main inverter control circuits, electric pumps, and LED headlights, where compact size, high current capability, and reliable mounting are essential. Application examples include main inverter control circuits, electric pumps, LED headlights, and other automotive electronic systems that require efficient and reliable power control.

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In recent years, automotive MOSFETs have been moving toward smaller package sizes, including 5060-size and even smaller formats. Smaller packages help save board space, which is important in modern vehicle designs. However, reducing size also creates problems. Narrow terminal spacing and leadless structures can make mounting less reliable and more difficult during assembly.

The HPLF5060 package is smaller than the commonly used TO-252 package. At the same time, it improves mounting reliability by using gull-wing leads. These leads make soldering more stable and help ensure secure attachment to the board. The package also uses copper clip junction technology. This supports high-current operation, which is required in demanding automotive environments.

Mass production of products using the HPLF5060 package began in November 2025. The sample price is $3.5 per unit, excluding tax. The devices are available for online purchase through distributors such as DigiKey and Farnell.

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The company is also working on expanding its package options. Mass production of the smaller DFN3333 package, which uses wettable flank technology, is planned for around February 2026. In addition, development has started on a TOLG package. This will further strengthen the lineup of high-power and high-reliability packages for automotive applications.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at EFY with a deep interest in embedded systems, development boards and IoT cloud solutions.

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