New SMT placement capability supports oversized AI server components up to 200 × 200mm and 2kg, addressing evolving packaging requirements for next-generation GPUs, ASICs, and co-packaged optics.
Fuji Corporation has expanded the capabilities of its NXTR and AIMEXR SMT pick-and-place platforms to support the placement of large, heavy electronic components measuring up to 200 × 200mm and weighing 2.0kg without requiring special machine configurations. The enhancement targets the growing manufacturing demands of AI servers and advanced computing hardware, where semiconductor packages continue to increase in size and complexity.
The new capability addresses emerging packaging trends driven by generative AI infrastructure. Modern AI servers increasingly employ larger GPU, ASIC, and High Bandwidth Memory (HBM) packages alongside advanced co-packaged optics (CPO) technologies that integrate optical communication directly with processors to improve bandwidth while reducing power consumption. These developments require SMT equipment capable of handling significantly larger substrates and heavier components than conventional electronics assembly.
The key features are:
- Supports components up to 200 × 200mm
- Handles payloads weighing up to 2.0kg
- Compatible with NXTR and AIMEXR standard configurations
- Designed under the Zero Placement Limits development concept
- Demonstrated placement capability under Fuji evaluation conditions
According to Fuji, both the NXTR and AIMEXR pick-and-place machines can now process these oversized components using their standard configurations, eliminating the need for dedicated hardware modifications. The company states this is an industry-first capability based on its internal research conducted in July 2026.
The enhancement forms part of Fuji’s Zero Placement Limits initiative, a long-term development strategy focused on removing placement restrictions encountered in surface mount manufacturing. Under this concept, the company is developing placement technologies that accommodate increasingly diverse component sizes, weights, and package formats as electronics continue to evolve.
Fuji validated the placement technology under its evaluation conditions, demonstrating the ability to accurately mount components weighing up to 2kg. The capability is expected to benefit manufacturers producing AI servers, high-performance computing platforms, networking equipment, and next-generation data center hardware where larger semiconductor packages and integrated optical modules are becoming standard.
As AI hardware continues to evolve, component dimensions and package weights are expected to increase further. Fuji says it will continue expanding the placement capabilities of its SMT platforms to support future electronics manufacturing requirements while enabling production lines to accommodate next-generation semiconductor packaging technologies without compromising automation efficiency.
