Connected devices gain Wi-Fi 7, Bluetooth 6.0, and Zigbee support for streaming, gaming, and multi-device connectivity.
Quectel Wireless Solutions has introduced two tri-band Wi-Fi 7 modules, the FCE870X and FME170X, aimed at connected devices that require high-speed, low-latency wireless communication. The modules target applications including set-top boxes, gaming systems, digital signage, VR/AR headsets, smart gateways, conference terminals, projectors, cloud computing devices, and other IoT products.
Both modules are built on the Synaptics SYN4384 chipset and support tri-band Wi-Fi 7 across the 2.4GHz, 5GHz, and 6GHz bands. They also integrate Bluetooth 6.0 and Zigbee/Thread over IEEE 802.15.4, enabling high-speed wireless connectivity, short-range communication, and low-power mesh networking in a single module.
The modules are designed for bandwidth-intensive applications such as 4K and 8K video streaming, cloud gaming, immersive AR/VR experiences, and multi-device connectivity, where low latency and reliable wireless performance are important.
The FCE870X and FME170X offer the same wireless capabilities but differ in form factor. The FCE870X uses a compact LCC package for embedded designs, while the FME170X comes in an M.2 package for modular, slot-based systems, giving device manufacturers flexibility in hardware design.
Both modules support x86, ARM, and MIPS host platforms and are compatible with chipsets from AMD, ST, NXP, Ambarella, Realtek, Novatek, Amlogic, Rockchip, and Sigmastar, allowing integration into a wide range of consumer and commercial connected devices.
“These high-end tri-band Wi-Fi 7 modules are engineered to run across the majority of Linux and Android platforms our customers already use. By offering the same advanced feature set in two package options, we’re giving product teams more choice in selecting the form factor that best matches their design, without compromising performance,” said Delbert Sun, Vice General Manager, Product Department, Quectel Wireless Solutions.
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