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Location: Goa

Company: Siemens

Key Responsibilities

Test Engineering & Optimisation

Develop, validate, and maintain ICT (In‑Circuit Test), FCT (Functional Circuit Test), and Boundary Scan (B‑Scan/JTAG) test programs for PCBA.
Define optimal test strategies combining ICT, B‑Scan, and FCT to maximise coverage and minimise escapes.
Support test fixture development, probe optimisation, and overall test coverage improvement.
Optimise test programs to improve First Pass Yield (FPY) while reducing false failures and retest rates.

Statistical Analysis & Drift Monitoring

Monitor component parameter drift and behavioural changes over time using production and test data.
Perform histogram analysis, distribution studies, trend monitoring, Cp/Cpk, and statistical correlation analysis.
Identify shifts caused by component ageing, supplier variation, and manufacturing process drift.
Refine ICT/FCT/B‑Scan test limits, algorithms, and guard bands based on statistical evidence.
Establish data‑driven criteria to clearly differentiate normal process variation from true failure conditions.

Failure Analysis & Root Cause

Perform in‑depth electrical and functional failure analysis on PCBA defects.
Debug issues related to components, solder joints, assembly process, design margins, and test coverage gaps.
Apply systematic root cause methodologies such as 5‑Why, Fishbone, Pareto, and correlation analysis.
Drive corrective and preventive actions with design, process, quality, and supplier teams.

Automation & Programming

Develop and enhance test programs, analysis scripts, and automation tools using:
VB.NET
Python
C++
Automate test data collection, report generation, statistical analysis, and failure trend monitoring.
Support integration of test systems with MES, databases, and cloud platforms where applicable.

Electronics & Debug

Strong foundation in analog and digital electronics.
Ability to read and interpret schematics, layouts, BOMs, and test specifications.
Hands‑on experience debugging PCBA‑level electrical and functional issues.

PCBA Assembly Process Knowledge

Strong understanding of SMT, THT, reflow soldering, wave soldering, and typical assembly defects.
Ability to correlate assembly process variation with test behavior and failures.

Bachelor’s degree in Electronics Engineering, or related field with 3+ years of experience in PCBA trsting..
Strong proficiency in advanced statistical analysis
Proficiency in programming languages and software tools used for test development (e.g., LabVIEW, VB.net, Python, C/C++).
Knowledge of Boundary scan technology.
Knowledge on microcontrollers and its basics.
Proven experience in in-circuit testing and electronic test engineering.
Familiarity with in-circuit testing equipment, such as flying probe testers and bed-of-nails testers.
Strong understanding of electronic components, circuit board design, and manufacturing processes.
Knowledge on board-level programming and communication protocols (JTAG, SPI, Serial – USB and RS232, Ethernet, GPIB)
Excellent problem-solving skills and attention to detail.
Effective communication and collaboration abilities.
Proven team player, high on collaboration with partners.