Hybrid Flyback Controller With High-Power Density And Efficiency

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It integrates flyback topology with resonant converter for natural soft switching and less switching losses

Rapid technology and market developments in the fast charger and adaptor market are continuously challenging the designers of power supply systems.

To meet the increasing demand for high power density and energy efficiency, the XDP family by Infineon Technologies AG now comes based on an asymmetric half-bridge flyback topology. The XDPS2201 is a highly integrated, multi-mode, digital and configurable hybrid flyback controller targeting high-density AC-DC power supplies, including USB PD fast charger and adaptor applications. 

The XDPS2201 combines the simplicity of a traditional flyback topology with the performance of a resonant converter, which allows natural soft switching and reduces switching losses associated with high-switching frequency designs. The controller enables zero voltage switching (ZVS) and zero current switching (ZCS) across AC line inputs, load conditions and variable output voltages. This feature is highly beneficial for high-frequency designs with a planar transformer that can typically be found in USB PD charger applications.

To achieve optimised performance under various output voltage, load and line input conditions, the XDPS2201 comes with an intelligent, self-adaptive digital algorithm. It supports a multi-mode operation to ensure that the best-fitting operation mode for each condition is selected to yield a continuously high-efficiency level. The hybrid flyback controller also integrates a comprehensive suite of protection features, including: 

  • Brown-in and -out
  • Dual-level overcurrent, output over-voltage, output under-voltage and over-temperature detection.

The asymmetric half-bridge flyback topology allows the implementation of CoolMOS MOSFETs to achieve the highest system efficiency and power density. The XDPS2201 is driving both high- and low-side MOSFETs in an asymmetric control manner. The product features an integrated high-side driver that allows BOM savings of up to 20 external components. The topology enables a snubber-less design and the use of high voltage MOSFETs from 500 V and up, which reduces the number as well as component costs.

Cost-effectively, the XDPS2201 supports high power density designs with an efficiency of up to 93.8 per cent and more than 92 per cent on average across different AC line and load conditions.

Available in a DSO-14 SMD package, the XDPS2201 can be ordered from Infineon Technologies AG now. 


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