Saturday, June 15, 2024

Haptic Force-Enhanced Trackpad Delivers Greater Functionality, Speed, and Accuracy

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Peratech, a tactile-sensing HMI company, and Innovobot Labs, an R&D and innovation design house, will unveil the new FusionPad Haptic Force-Enhanced Trackpad at CES in Las Vegas, January 5-8. FusionPad will greatly enhance the notebook user experience. Instead of just one click, it delivers a broad range of user interactions, including multiple clicks to expand functionality and fast, accurate haptic feedback to optimize control. It also eliminates false touch while typing.

FusionPad is thin, allowing for a bigger battery and greater air flow to cool processors and improve overall performance. It is integration-ready and compatible with existing product engineering tools. It is also process and technology ready for AVL-approved supply chains.

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FusionPad combines Peratech’s patented Quantum Tunneling Composites technology and Innovobot Labs’ applied haptics design. “This collaboration exemplifies our innovation model, where Peratech and Innovobot Labs have joined forces to build a superior product that integrates the best in haptics effects and force sensing,” says Innovobot CEO, Mario Venditti.

Peratech’s sensing matrix, made of hundreds of individual force sensors, detects different levels of applied pressure not only identifying an intensity, but also a profile – the difference between a finger and a pen, for example – with no inconsistencies. The haptic output developed by Innovobot Labs offers an expanded high-fidelity frequency range of 150 Hz to 350 Hz, as opposed to the limited single frequencies currently available on the market.

“The tactile-feedback loop between great, consistent sensing and beyond single-click haptics, drives the new level of expanded functionality that FusionPad makes available to OEMs and their end-users,” states Jon Stark, CEO at Peratech. “What’s more, our firmware intelligence enables a design philosophy that uses ordinary parts in extraordinary ways, making FusionPad more affordable to the broader OEM market.”



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