Sunday, July 14, 2024

MCU Series For Smart And Industrial Connectivity

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The series features Wi-Fi 6, Bluetooth LE 5.2, and RISC-V core, designed for wireless applications in smart homes, IoT, and industrial systems.


GigaDevice, a supplier in the semiconductor industry, announced the GD32VW553 Combo Wireless MCU, based on the RISC-V core. The MCU series boasts Wi-Fi 6 and Bluetooth LE 5.2 compatibility, enhancing wireless connectivity. It includes Radio Frequency Integrated Circuits (RFIC), security features, storage space, and various interfaces. The series is produced using an established process and cost reductions to serve markets needing wireless functionalities. The series offers eight models.

The series is suited for edge processing and connectivity, applicable in wireless applications like smart home devices, industrial internet systems, and communication gateways. Its cost-effectiveness makes it suitable for office equipment, payment terminals, and IoT products.

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The MCU series includes a new open-source instruction set architecture with the RISC-V processor core featuring a clock frequency of 160 MHz. It has DSP hardware acceleration, a floating-point unit (FPU), instruction expansion interfaces, and other resources. This design is energy-efficient and scalable.

The series integrates Flash, SRAM, and Instruction Cache (I-Cache), enhancing CPU efficiency. It includes wired interfaces, timers, and an ADC and operates at a power supply voltage of 1.8 V to 3.6 V, supporting temperatures up to 105℃.

For security, the series offers Wi-Fi Protected Access (WPA) with WPA3 encryption, hardware encryption and decryption engines, a Public Key Cryptographic Acceleration Unit (PKCAU), and a True Random Number Generator (TRNG), ensuring secure connections and management of wireless devices.

GigaDevice’s Product Marketing Director Eric Jin stated, “The new GD32VW553 series, with its optimized RISC-V open-source instruction set architecture, incorporates the microcontroller with advanced Combo Wireless connection protocols. This addresses the increasing connectivity demands in the thriving home appliances and emerging AIoT market, balancing processing performance, solution design, and material costs. With an ongoing expansion of the GD32 RF development platform, it adeptly addresses wireless design challenges in hi-density and intricate environments, presenting developers with a secure, dependable, energy-efficient, and efficient connectivity experience.”

For more information, click here.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a journalist at EFY. She is an Electronics and Communication Engineer with over five years of academic experience. Her expertise lies in working with development boards and IoT cloud. She enjoys writing as it enables her to share her knowledge and insights related to electronics, with like-minded techies.


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