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World’s Smallest Integrated Speaker-Microphone

The new integrated speaker-microphone changes what’s possible in wearables and TWS devices. Ready to learn more?

SONICEDGE UNVEILS WORLD’S FIRST MEMS SPEAKER- MICROPHONE SOLUTION FOR TWS DEVICES
SONICEDGE UNVEILS WORLD’S FIRST MEMS SPEAKER- MICROPHONE SOLUTION FOR TWS DEVICES

SonicEdge LTD has launched SonicTwin, which the company claims to be the world’s smallest integrated speaker-microphone for True Wireless Stereo (TWS) earbuds and headphones. At just 8 x 4 x 1 mm, SonicTwin combines sound generation and sensing in a single package, redefining compact audio technology. It can benefit companies developing wearables, hearing aids, and innovative audio solutions by enabling smaller, more efficient designs with advanced audio and sensing capabilities. 

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Using SonicEdge’s patented modulated ultrasound technology, SonicTwin removes the need for traditional mechanical vibrations, allowing seamless integration of speakers and sensors. This design compactly delivers high Sound Pressure Levels (SPL), expanding possibilities for TWS devices and wearables.

SonicTwin simplifies production by reducing component count, streamlining assembly, and speeding up time-to-market. As part of SonicEdge’s MEMS-based product lineup, it enables next-generation integrated speaker-sensor solutions for applications in environmental awareness, health monitoring, and more.

“SonicTwin is a game-changer,” said Moti Margalit, CEO and founder of SonicEdge. “It unlocks immersive, integrated audio solutions and sets a new standard for wearables and beyond. Its ultra-compact size enables true in-ear canal integration, providing unmatched performance, comfort, and active noise cancellation (ANC) for TWS earbuds and headphones. With SonicTwin, manufacturers can design smaller devices or allocate more space for larger batteries, offering unprecedented freedom in product design.”

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“SonicTwin reduces latency and enables better ANC’,” said Ari Mizrachi, CTO and co-founder of SonicEdge. “Our modulated ultrasound technology replaces traditional voice coils, resulting in higher efficiency, superior sound quality, and co-packaged sensors—all in size once thought impossible.”

For more information, click here.

Nidhi Agarwal
Nidhi Agarwal
Nidhi Agarwal is a Senior Technology Journalist at Electronics For You, specialising in embedded systems, development boards, and IoT cloud solutions. With a Master’s degree in Signal Processing, she combines strong technical knowledge with hands-on industry experience to deliver clear, insightful, and application-focused content. Nidhi began her career in engineering roles, working as a Product Engineer at Makerdemy, where she gained practical exposure to IoT systems, development platforms, and real-world implementation challenges. She has also worked as an IoT intern and robotics developer, building a solid foundation in hardware-software integration and emerging technologies. Before transitioning fully into technology journalism, she spent several years in academia as an Assistant Professor and Lecturer, teaching electronics and related subjects. This background reflects in her writing, which is structured, easy to understand, and highly educational for both students and professionals. At Electronics For You, Nidhi covers a wide range of topics including embedded development, cloud-connected devices, and next-generation electronics platforms. Her work focuses on simplifying complex technologies while maintaining technical accuracy, helping engineers, developers, and learners stay updated in a rapidly evolving ecosystem.

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