HomeElectronics NewsANSYS Bolster ARM Energy-Efficient IP For Internet Of Things And Cloud

ANSYS Bolster ARM Energy-Efficient IP For Internet Of Things And Cloud

ANSYS has licensed its engineering simulation software tools to ARM, the world’s leading semiconductor intellectual property (IP) company for power efficiency, performance and reliability. The agreement will aid the ARM ecosystem and ARM® processor technology serving multiple markets including mobile computing, networking infrastructure, transportation and Internet of Things (IoT) applications.

Modern electronic products require high performance and reliability as well as minimal power. This is accomplished by combining multiple sub-systems of an electronic product into one or more integrated circuits (IC) called a system on a chip (SoC). Minimizing power consumption and energy efficiency are critical design requirements for the Internet of Things (IoT) applications.
ANSYS simulation technology will support ARM in its continued development of cutting edge semiconductor IP and the ARM ecosystem partners design reliable and robust semiconductor chips. ANSYS® Redhawk™, ANSYS® Totem™ and ANSYS® PowerArtist™ simulation solutions will help with electrostatic discharge, electromigration, power modeling, analyzing and validating foundation IP building blocks, as well as central processing units and graphics processing unit cores.

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“The demand for reliable, robust and power efficient designs increases in a smart connected world as many devices will have to operate in energy-constrained environments,” said Brent Dichter, vice president, engineering flows, ARM. “The SoC’s design is a key part of the energy-efficiency equation. Giving our semiconductor partners access to our IP through ANSYS’ simulation tools enables them to optimize their designs earlier and allow more time to be spent creating competitive products that smooth their delivery path.”

“The powerful combination of ARM’s IP development expertise with ANSYS simulation tools strengthens ARM’s ability to provide world-class energy-efficient IP for various vertical segments of IoT,” said Vic Kulkarni, vice president and general manager, ANSYS. “By utilizing ANSYS technology, ARM and its ecosystem partners can design smarter and faster chips for electronic devices more easily.”

Dilin Anand
Dilin Anand
Dilin Anand is the Senior Vice President at Electronics For You Group, where he plays a key role in connecting the global engineering ecosystem with India’s rapidly evolving electronics and technology landscape. A core member of the EFY editorial team since 2011, he has been instrumental in shaping content, strategy, and industry engagement across the group’s platforms. With over a decade of experience in technology publishing and ecosystem building, Dilin focuses on bridging the gap between engineers, innovators, and industry stakeholders. His work spans editorial leadership, strategic partnerships, and initiatives aimed at empowering the engineering community with relevant, high-quality knowledge and opportunities. He has also completed the Venture Advancement Program in Entrepreneurship and Entrepreneurial Studies at Massachusetts Institute of Technology, strengthening his perspective on innovation, startups, and technology-driven growth. Dilin is particularly passionate about enabling knowledge exchange, fostering collaboration, and supporting the growth of India’s engineering ecosystem through impactful content and initiatives.

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