Working with small electronic parts? Titanium solder masks help control solder, protect components, and make soldering more reliable.
For engineers working with complex assemblies, traditional composite materials often struggle with intricate masking. When assemblies are mounted in housings and SMD components sit close to THT solder joints, walls, separating bars, and connections need to be extremely thin while staying stable over time. Baffles and pressure chambers also need precise manufacturing, especially as designs get smaller. To address this, Eutect GmbH has developed titanium solder masks designed to improve precision, process stability, and cost efficiency in selective soldering.
These titanium masks allow separator widths below 0.5 mm while offering high durability, chemical resistance, and thermal stability under repeated process cycles. Specially treated surfaces repel solder and reduce heat sinks, protecting sensitive components while improving solder wetting and penetration. Three-dimensional designs help compensate for component tolerances, enabling reliable soldering even in thin-walled constructions.
Customer-specific designs can include fixing and holding elements, catch geometries, and other features to ensure alignment between assembly, soldering process, and automation. When used with custom solder nozzles and optimized process parameters, the masks support stable mini-wave and selective soldering, resulting in high-quality solder joints, reduced material stress, improved reliability, and cost efficiency.
Eutect manufactures these titanium masks for its own systems as well as for third-party users. They combine materials, design, and process engineering to help achieve precise, stable, and efficient selective soldering, making them a key tool for modern manufacturing processes.
“Selective soldering of electronic assemblies is becoming increasingly challenging due to increasing miniaturization, complex geometries, and higher requirements for process reliability and durability. To meet these challenges, we have been relying on customer-specific solder masks developed in-house since 1996,” explains Matthias Fehrenbach, Managing Director of Eutect GmbH. Titanium solder masks precisely control the solder flow on a printed circuit board, limit the solder supply to specific areas, and protect sensitive components. “Our masks are created in our in-house technical center, often in combination with the development of the appropriate solder nozzle, so that end customers receive a complete, optimally coordinated solution for our systems as well as for third-party systems,” Fehrenbach continues.
