Understand how IC substrates adapt to durability signal and sustainability demands faced by manufacturers and users of modern smart cards.
Smart cards used in payment systems, identity documents, and mobile networks rely on IC substrates to transfer signals reliably between the chip and external readers. As these cards are repeatedly inserted, scanned and handled, the substrate must maintain electrical performance while withstanding long term mechanical wear. At the same time, manufacturers are under pressure to reduce production complexity and lower environmental impact, particularly from processes involving precious metal plating.
Addressing these challenges, LG Innotek has developed what it describes as a next generation smart IC substrate that removes the need for precious metal surface plating. The substrate is used in applications such as credit cards, electronic passports and USIMs, where stable signal transmission and durability are critical.
Traditionally, gold or palladium plating has been used to ensure low contact resistance and corrosion resistance at the IC reader interface. According to the company, the newly developed material maintains reliable signal transmission without this plating step. By eliminating the process, manufacturing is simplified and emissions linked to precious metal mining and refining are reduced.
The company states that production related carbon emissions are reduced by around 50 percent, equivalent to approximately 8,500 tons of carbon dioxide annually. In addition to environmental gains, the substrate is reported to offer three times higher durability than conventional products, helping reduce read errors caused by repeated use.
Key features of the substrate include:
- No precious metal plating requirement
- Improved signal reliability at IC reader contact points
- Durability increased by three times compared to existing substrates
- Carbon emissions reduction by around 50%
Jeffrey Cho, executive vice president and head of the company’s Package Solution Business, says, “The ‘Next-Generation Smart IC Substrate’ both satisfies customers’ ESG requirements and offers technological competitiveness. We will continue presenting innovative products that create differentiated customer value, making us a partner that realizes our customer’s visions.”
