Two power switches in one package save board space, reduce power loss, and help engineers build power systems.
Alpha and Omega Semiconductor (AOS) has introduced the AOPL66801, an 80V MOSFET in a half-bridge configuration designed to help engineers build smaller and more efficient power conversion systems. Available in the company’s DFN6x5 AmpStack package, the device targets applications ranging from next-generation megawatt AI data centres to industrial equipment and power tools, where high power density and efficient use of PCB space are important.
The AOPL66801 uses AOS’ vertically stacked die packaging technology, integrating two MOSFETs into a single package. One functions as the high-side MOSFET and the other as the low-side MOSFET, forming a complete half-bridge. Compared to a design that uses two separate DFN5x6 discrete MOSFETs, this approach increases power density while freeing up PCB space for other components.
The package also features an optimized clip design for the switch node connecting the two MOSFETs. This reduces parasitic inductance between the high-side and low-side devices, minimizing phase-node voltage ringing during switching and lowering electrical stress on the MOSFETs. Compared to conventional discrete solutions, the design also reduces parasitic inductance on the PCB, helping improve switching performance and system reliability.
AOS has also addressed gate-drive performance, which is often affected by PCB parasitic inductance. The AOPL66801 includes a Kelvin sense pin that provides a dedicated low-inductance gate-drive path. This helps maintain gate-voltage stability during high di/dt switching, improves the drive path for the high-side MOSFET, and reduces switching losses.
The device supports a maximum junction temperature of 175°C, allowing it to operate under demanding thermal conditions. According to AOS, the combination of vertically stacked die technology, reduced parasitic inductance, Kelvin sensing, and high-temperature operation delivers system-level improvements, enabling designers to achieve higher power density, better operational efficiency, simplified PCB layouts, and improved performance across a wide range of power conversion applications.
