Friday, December 5, 2025

Next-Gen High-Density Ethernet Reference Design

Built to speed up prototyping and reduce design risk, it offers engineers a ready-made blueprint for enterprise, data center, and edge networking solutions.

Next-Gen High-Density Ethernet Reference Design

For design engineers tasked with developing next-generation networking equipment, reference designs play a critical role in reducing complexity, saving development time, and minimizing risks in the design cycle. Instead of starting from scratch, engineers gain access to a proven system-level blueprint that demonstrates best practices in hardware layout, signal integrity, power optimization, and thermal management. This helps them accelerate prototyping, validate performance faster, and concentrate on differentiating features that add value to the final product.

Microchip continues to strengthen its presence in networking solutions with the launch of a comprehensive reference design for high-density Ethernet switching platforms. Developed to accelerate system development and reduce design complexity, this solution enables OEMs and design engineers to build advanced switching equipment that meets the performance, scalability, and interoperability requirements of modern data and enterprise networks.

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The company has introduced a 56-Port Ethernet Switch Reference Design that integrates 48 copper ports supporting gigabit connectivity, alongside four ports designed for higher-speed optical interfaces and four ports optimized for multi-gigabit copper connections. This combination offers flexibility for both enterprise and data center applications, addressing growing demand for mixed-port, high-bandwidth network infrastructures. By offering a ready-to-use hardware and software framework, the design shortens time-to-market for manufacturers while ensuring robust performance under varied deployment scenarios.

The reference design comes with a rich feature set to match its broad application scope. Key highlights include support for scalable Ethernet switching, optimized thermal and power management, and high port density in a compact architecture. With its ability to handle multiple interface types, the design finds relevance in enterprise backbone networks, aggregation switches, top-of-rack data center deployments, and even industrial or edge networking scenarios where performance and reliability are critical. Enhanced with features that simplify monitoring, configuration, and diagnostics, the platform ensures ease of integration into existing network ecosystems.

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To help developers quickly prototype and scale their solutions, the reference design package provides access to essential documentation, schematics, layout guidelines, and test reports. Software support is also included to accelerate bring-up and evaluation, reducing engineering effort in the early stages of product development. Together, these resources enable system designers to focus on product differentiation and faster deployment. The design package can be accessed directly from the website by clicking here.

Akanksha Gaur
Akanksha Gaur
Akanksha Sondhi Gaur is a journalist at EFY. She has a German patent and brings a robust blend of 7 years of industrial & academic prowess to the table. Passionate about electronics, she has penned numerous research papers showcasing her expertise and keen insight.

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