The design brings Wi-Fi, Bluetooth, LTE, GPS, and NFC together in one place. It helps connect vehicles to the cloud, update software, and use phones.
The AS049-1-REIN-WCU-V1 reference design from Renesas is a wireless communication unit that brings together multiple connectivity modules on a single board. It features the DA16200MOD Wi-Fi module and the DA14531MOD Bluetooth Low Energy (BLE) module from Renesas, and the EC25 LTE+GPS module from Quectel. The design also includes support for Near Field Communication (NFC), enabling a broad set of short-range wireless use cases. Each module interfaces with host microcontrollers using standard communication methods—SPI for Wi-Fi, UART for BLE, LTE, and GPS, and general-purpose I/O lines for flexible control.
The board is designed with two power input options. Power Connector J10 allows direct powering using a 12V DC supply, suitable for standalone operation. Alternatively, Power Connector J11 enables the board to draw power from an external host system, such as the Renesas AS260. The design also incorporates onboard level shifters, allowing seamless interfacing with host MCUs that operate at different voltage levels. This increases compatibility across a wide range of embedded and automotive platforms.
By integrating all key wireless technologies—Bluetooth LE, Wi-Fi, LTE, GPS, and NFC—the design supports comprehensive wireless communication in one compact unit. The pre-mounted modules reduce the need for additional hardware components and simplify PCB layout. The common J1 connector streamlines connection to the host MCU, making the board easy to incorporate into existing systems without significant redesign.
This design plays a critical role in the transition to software-defined vehicles (SDVs). It supports over-the-air (OTA) software updates for Electronic Control Units (ECUs), allowing vehicle software to be updated remotely. This removes the need for physical access during software rollouts and ensures that vehicle systems remain current. NFC support enables additional use cases such as pairing smartphones with the vehicle’s infotainment system or enabling tap-based in-vehicle payments.
The use of energy-efficient wireless modules helps reduce the overall power consumption of the system. This is especially important in automotive environments where power efficiency directly affects system design and reliability. The board’s flexible voltage and communication interface options allow developers to quickly integrate it into both new and legacy systems.
In practice, this design transforms a standard automotive cluster into a connected cluster. It enables cloud connectivity, real-time diagnostics, and supports modern features like remote access and data logging. For users, this translates to a better in-vehicle experience, including seamless smartphone integration, secure payments, and fewer service visits. For developers and OEMs, it reduces development time, supports scalable telematics solutions, and provides a ready path to connected and intelligent vehicle platforms.
Renesas has tested this reference design. It comes with a bill of materials (BOM), schematics, assembly drawing, printed circuit board (PCB) layout, and more. The company’s website has additional data about the reference design. To read more about this reference design, click here.
