Can PCB reinforcement become faster without underfill? A light-curing adhesive aims to improve assembly reliability for compact, high-density electronic designs.
Dymax has introduced its 9310 light-curing adhesive to reinforce fine-pitch, leadless components on printed circuit boards (PCBs), providing an alternative to conventional underfill processes for advanced electronics and AI hardware. The material is designed to improve mechanical reliability while simplifying component reinforcement during manufacturing.
As electronic assemblies become more compact, solder joints and surface-mounted components are increasingly exposed to thermal expansion and mechanical stress during assembly and operation. Reinforcement materials help improve long-term reliability, but traditional underfill processes can add manufacturing complexity. The adhesive is intended to reduce these additional process steps while maintaining bond strength across demanding applications.
The material cures within seconds when exposed to light, enabling faster processing during PCB assembly. A secondary heat-curing mechanism ensures complete polymerisation in areas where light cannot reach, supporting consistent curing across complex board layouts. The adhesive is formulated to maintain adhesion through high-temperature reflow while providing 145% elongation and a controlled modulus, allowing it to flex under thermal and mechanical strain and reduce stress transferred to solder joints and electronic components.
Its high viscosity and thixotropic formulation enable controlled edge bonding without unwanted material flow, improving placement accuracy and process consistency. The adhesive is also reworkable at relatively low temperatures, allowing manufacturers to remove or replace components more easily during production or repair without exposing assemblies to excessive heat. These characteristics make the material suitable for high-density electronic assemblies where both manufacturing efficiency and long-term reliability are important.
“9310 makes it easier to reinforce components quickly and consistently, without the added steps and complexity of underfill,” says Doug Katze, Senior Electronics Business Development Manager at Dymax.
Click here for the official announcement.
