Designed for smart home, industrial, wearable, and IoT applications, this new platform accelerates time-to-market with comprehensive software tools and extensive peripheral support.
Infineon Technologies announced the AIROC CYW5591x Connected Microcontroller (MCU) product family. This family integrates Wi-Fi 6/6E and Bluetooth Low Energy 5.4 with a secure and versatile MCU, enabling customers to develop cost-optimized, power-efficient, small form-factor products for smart home, industrial, wearables, and other IoT applications. The platform accelerates time-to-market with ModusToolbox software, RTOS and Linux host drivers, a validated Bluetooth stack, sample code, Matter software enablement, and support from Infineon’s partner network.
The device family can function as the main processor in an IoT device or as a subsystem in complex designs to offload connectivity for IoT applications. The family includes three versions: CYW55913 (tri-band 2.4/5/6 GHz), CYW55912 (dual-band 2.4/5 GHz), and CYW55911 (single-band 2.4GHz).
Key features of the new devices include:
- Up to +24 dBm transmit power for Wi-Fi
- Matter-over-Wi-Fi support
- Optimized Bluetooth Low Energy range and power with up to +19 dBm transmit power
- PSA Level 2 Certifiable
It features an Arm Cortex M33 192MHz MCU with TrustZone CC312 and 768 KB SRAM, offering robust security and performance. It includes Quad-SPI with XIP and on-the-fly encryption/decryption for FLASH and PSRAM, ensuring data integrity and speed. The MCU supports 1×1 Tri-Band (2.4/5/6 GHz) 20MHz Wi-Fi 6/6E (802.11ax) for high-speed wireless connectivity and Bluetooth Low Energy 5.4, which offers 2 Mbps, LE Long Range, Advertising Extensions, and Advertising code selection for enhanced range and efficiency. The MCU provides extensive peripherals and GPIO support, including 3xSCB (I2C/SPI/UART), TCPWM, 7-channel 12-bit ADC, Digital Microphone support, TCM (I2S/PCM), and up to 47 GPIOs, catering to diverse application needs. It also supports hardware encryption standards like AES, RSA, ECC, ECDHA, ECDSA, and Root-of-Trust. The multi-layer security features include lifecycle management, secure boot with firmware authentication and encryption, anti-rollback, and crypto key establishment and management.
The company offers an extensive module and platform partners ecosystem to meet specific application requirements. The CYW55913/2/1 is currently sampling to alpha customers. Sivaram Trikutam, Vice President of Wi-Fi Products at Infineon Technologies, emphasized Infineon’s commitment to decarbonization and digitalization with low-power solutions connecting products to the cloud. The AIROC CYW5591x Connected MCU family combines user-friendly software with wireless performance and low power consumption to build advanced IoT products.
