Explore how semiconductors combining computing, sensing and networking deliver Level 3 autonomous driving and advanced driver assistance performance.
TI accelerates the shift toward autonomous vehicles with expanded automotive portfolio
As vehicles become more software defined and increasingly autonomous, automakers are under pressure to deliver faster AI decision making, accurate sensing, and reliable in vehicle connectivity across all vehicle segments. Achieving this at scale requires computing platforms and sensing technologies that balance performance, power efficiency, and functional safety without increasing system complexity.
Texas Instruments announced an expanded automotive semiconductor portfolio aimed at advancing safety and autonomy across vehicle fleets. Targeting advanced driver assistance systems and software defined vehicles up to SAE Level 3 autonomy, the update includes:
- A high performance computing SoC
- An integrated 4D imaging radar transceiver, and
- An automotive Ethernet physical layer device
The high performance computing SoC family is designed to support centralized vehicle architectures and real time AI workloads. The scalable platform delivers edge AI performance ranging from 10 to 1200 trillion operations per second, enabled by a proprietary neural processing unit and a chiplet ready design. Built on a safety-first architecture, the SoCs support cross domain fusion of ADAS, infotainment, and gateway functions within a single device.
To enhance perception, the portfolio also adds a single chip 8 by 8 4D imaging radar transceiver that integrates 8 transmitters and 8 receivers. This approach simplifies high resolution radar system design while enabling advanced use cases such as long range detection, improved object separation and reliable operation in adverse weather.
In vehicle networking is addressed through a 10BASE T1S Ethernet physical layer solution that extends Ethernet connectivity to vehicle edge nodes. The device supports time synchronization and power over the data line, helping reduce wiring complexity and system cost.
Key technology features include:
- Scalable edge AI performance up to 1200 TOPS
- Proprietary neural processing unit with chiplet ready design
- Single chip eight by eight 4D imaging radar integration
- Extended Ethernet connectivity to vehicle edge nodes
- Support for centralized and software defined vehicle architectures
Mark Ng, director of automotive systems says, “Semiconductors are at the heart of bringing safer, smarter and more autonomous driving experiences to every vehicle,” highlighting the role of integrated sensing, computing and connectivity in scaling autonomy across fleets.
