An AI platform brings PCB and advanced packaging design, simulation, and optimization into one workflow to reduce design time and manual work.
Cadence has launched the AuraStack AI Super Agent, an AI platform for PCB and advanced packaging design that brings system planning, design, simulation, and analysis into a single environment. The company says the platform can reduce design time by up to 2×, improve engineering productivity by up to 15×, and help identify design issues earlier in the development cycle.
Integrated with Cadence Allegro AI Studio, the platform uses multiple AI agents to automate tasks across planning, layout, implementation, design-for-manufacturing, and signoff. It is accelerated by NVIDIA Blackwell GPUs and NVIDIA CUDA-X libraries.
AuraStack also combines electrical, thermal, and mechanical analysis in one workflow. Engineers can evaluate signal and power integrity (SI/PI), thermal performance, mechanical stress, vibration, drop, and fatigue throughout the design process instead of waiting until the final stages. According to Cadence, this continuous feedback helps reduce design iterations and costly PCB respins while improving system reliability.
The platform supports system planning, constraint management, physical structure definition, IP creation and reuse, place-and-route, and multiphysics analysis. It also enables co-optimization of PCBs with advanced packaging designs.
Cadence says AuraStack extends its AI-based design portfolio, joining the company’s ChipStack, InnoStack, and ViraStack AI Super Agents. Together, these tools cover the electronic system design flow from silicon and advanced packaging to PCB design.
The company says the platform is designed for increasingly complex systems used in AI infrastructure, data centers, automotive, aerospace, and other high-performance applications, where growing design complexity has increased the need for automation.
“The scale and complexity of modern AI infrastructure demands a new design approach,” said Tim Costa, vice president and general manager of computational engineering at NVIDIA. “The Cadence AuraStack AI Super Agent and the Millennium M2000 Supercomputer deliver up to 20X faster multiphysics performance, giving our engineers the capability to tackle the most demanding design challenges and bring the next generation of AI infrastructure to life.”
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