A new COM-HPC Client module integrates CPU, GPU and NPU resources into a single embedded platform, enabling AI inference, real-time control and graphics-intensive workloads for rugged edge applications without requiring discrete AI accelerators.
Congatec has introduced the conga-HPC/cRX1, a COM-HPC Client Size C Computer-on-Module powered by AMD Ryzen AI Embedded X100 Series processors. Designed for compute-intensive embedded AI applications, the module combines CPU, GPU and neural processing capabilities on a single platform, enabling developers to build compact edge systems without relying on dedicated AI accelerator cards.
The module targets physical AI deployments where sensing, decision-making and control must operate together in real time. Intended applications include robotics, autonomous agricultural and logistics vehicles, forestry equipment, medical devices and industrial automation systems that require high-performance computing in demanding environments.
The key features are:
- Supports up to four independent 4K displays
- Offers up to 24 PCIe Gen4 lanes for expansion
- Includes up to 512GB onboard NVMe storage
- Provides 2× 2.5GbE along with multiple USB, SATA and industrial interfaces
- Supports Windows 11, Windows 11 IoT Enterprise and Linux
At its core, the conga-HPC/cRX1 features processors with up to 16 AMD Zen 5 CPU cores running at frequencies of up to 5.1GHz. The integrated AMD Radeon RDNA 3.5 GPU delivers up to 59 TOPS of INT8 AI inference performance and 29.7 TFLOPS of FP32 computing capability. In comparison, the dedicated AMD XDNA 2 NPU contributes up to 50 TOPS for always-on AI workloads such as image processing, object recognition and speech processing. The combined architecture also supports local execution of large language models (LLMs).
For memory-intensive workloads, the module supports up to 128GB of soldered LPDDR5X-8533 unified memory, allowing the CPU, GPU, and NPU to share data while efficiently improving resistance to shock and vibration. Configurable power consumption ranges from 45W to 120W, with a base TDP of 55W, enabling system designers to optimise either performance or energy efficiency. Industrial-grade variants operate across a temperature range of -40°C to +85°C, making them suitable for harsh environments.
To simplify deployment, the module incorporates TPM 2.0-based security, is developed in accordance with IEC 62443-4-1 cybersecurity practices, and is available with preconfigured operating systems and virtualisation options that allow AI, real-time control, HMI and IoT gateway functions to run on a single hardware platform.
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